Re: [External Email] [APDL] Permanently change bond's thermal conductance . C

PS
Parameshwarayya S Mathapati
Tue, Nov 1, 2022 4:13 AM

On Nov 1, 2022 2:02 AM, "Mohammad Gharaibeh via Xansys" <
xansys-temp@list.xansys.org> wrote:

A quick thought:

Can’t you use submodeling? The global model is the model with temperature
rise. The local model is for cooling down stage. You can define TCC as
function of temperature in the local model but in reverse scheme, in a
similar fashion of what have you provided.

Hope this works!

Best,
Mohammad

On Monday, October 31, 2022, Caba, Aaron (US) via Xansys <
xansys-temp@list.xansys.org> wrote:

I have a transient thermal problem where two parts are bonded together
with an adhesive.  During the (one time) use, the bond line gets hot

enough

to char the adhesive and cause a change in the thermal conductance across
the bond line.  I'm using contact between the parts with a specified
thermal conductance (TCC) instead of trying to explicitly model the
adhesive.  I have figured out how to make the Thermal Conductance
Coefficient depend on the temperature at the interface with a command

snip

in the contact definition:

*dim,myTCC,Table,4,,,TEMP
*taxis,myTCC(1),1,0,200,220,2000  ! Temperature in C
myTCC(1,1)=800,800,50,50            ! TCC value
rmod, tid, 14,%myTCC%
rmod, cid, 14,%myTCC%

This works great as long as the temperature is monotonically increasing,
but I also have experimental data through the cool-down phase that I want
to match.  Unfortunately, my APDL solution is reversible in temperature

and

the bond begins conducting again when the assembly starts to cool.

Does anyone have an idea how to permanently and irreversibly change the
Thermal Conductance Coefficient of the contact as a function of

temperature

and/or temperature history?

Thanks!

Aaron C. Caba, Ph.D.
Sr. Principal R&D Engineer II
BAE Systems, Inc. | Ordnance Systems, Inc.

E-mail: aaron.caba@baesystems.com | Mail:  4050 Peppers Ferry Road,
Radford VA 24143-0100
www.baesystems.com


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--

---====
Mohammad A Gharaibeh, Ph.D.
Associate Professor
Department of Mechanical Engineering
The Hashemite University
P.O. Box 330127
Zarqa, 13133, Jordan
Tel: +962 - 5 - 390 3333 Ext. 4771
Fax: +962 - 5 - 382 6348

---====


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On Nov 1, 2022 2:02 AM, "Mohammad Gharaibeh via Xansys" < xansys-temp@list.xansys.org> wrote: > A quick thought: > > Can’t you use submodeling? The global model is the model with temperature > rise. The local model is for cooling down stage. You can define TCC as > function of temperature in the local model but in reverse scheme, in a > similar fashion of what have you provided. > > Hope this works! > > Best, > Mohammad > > On Monday, October 31, 2022, Caba, Aaron (US) via Xansys < > xansys-temp@list.xansys.org> wrote: > > > I have a transient thermal problem where two parts are bonded together > > with an adhesive. During the (one time) use, the bond line gets hot > enough > > to char the adhesive and cause a change in the thermal conductance across > > the bond line. I'm using contact between the parts with a specified > > thermal conductance (TCC) instead of trying to explicitly model the > > adhesive. I have figured out how to make the Thermal Conductance > > Coefficient depend on the temperature at the interface with a command > snip > > in the contact definition: > > > > *dim,myTCC,Table,4,,,TEMP > > *taxis,myTCC(1),1,0,200,220,2000 ! Temperature in C > > myTCC(1,1)=800,800,50,50 ! TCC value > > rmod, tid, 14,%myTCC% > > rmod, cid, 14,%myTCC% > > > > This works great as long as the temperature is monotonically increasing, > > but I also have experimental data through the cool-down phase that I want > > to match. Unfortunately, my APDL solution is reversible in temperature > and > > the bond begins conducting again when the assembly starts to cool. > > > > Does anyone have an idea how to permanently and irreversibly change the > > Thermal Conductance Coefficient of the contact as a function of > temperature > > and/or temperature history? > > > > Thanks! > > > > Aaron C. Caba, Ph.D. > > Sr. Principal R&D Engineer II > > BAE Systems, Inc. | Ordnance Systems, Inc. > > > > E-mail: aaron.caba@baesystems.com | Mail: 4050 Peppers Ferry Road, > > Radford VA 24143-0100 > > www.baesystems.com > > _______________________________________________ > > Xansys mailing list -- xansys-temp@list.xansys.org > > To unsubscribe send an email to xansys-temp-leave@list.xansys.org > > If you are receiving too many emails from XANSYS please consider changing > > account settings to Digest mode which will send a single email per day. > > > > Please send administrative requests such as deletion from XANSYS to > > xansys-mod@tynecomp.co.uk and not to the list > > > > > -- > ===================================== > Mohammad A Gharaibeh, Ph.D. > Associate Professor > Department of Mechanical Engineering > The Hashemite University > P.O. Box 330127 > Zarqa, 13133, Jordan > Tel: +962 - 5 - 390 3333 Ext. 4771 > Fax: +962 - 5 - 382 6348 > ===================================== > _______________________________________________ > Xansys mailing list -- xansys-temp@list.xansys.org > To unsubscribe send an email to xansys-temp-leave@list.xansys.org > If you are receiving too many emails from XANSYS please consider changing > account settings to Digest mode which will send a single email per day. > > Please send administrative requests such as deletion from XANSYS to > xansys-mod@tynecomp.co.uk and not to the list