Dear XANSYSers; I am writing to share my just published review paper that collects the mechanical properties of various lead-based and lead-free solder alloys as well as other emerging joining materials like sintered silver, sintered copper and transient liquid phase tin-lead material. The paper compiles the properties from about 200 references and includes elastic and inelastic properties (Power Law, Hyperbolic Sine Law, and Anand's Model). The paper also discusses the possible reasons behind the huge discrepancies in the reported properties. The manuscript also recommends the development and the design of an engineering standard for testing/measuring the mechanical properties of such important interconnections. Some tips are also provided. The paper link is attached below (open access) and, for the people in the field, I thought you might find it useful for your simulations. Please read and let me hear your constructive feedback! Link: https://www.sciencedirect.com/science/article/pii/S2590123025016883 Best Wishes, Mohammad ===================================== Mohammad A Gharaibeh, Ph.D. Associate Professor Department of Mechanical Engineering The Hashemite University P.O. Box 330127 Zarqa, 13133, Jordan Tel: +962 - 5 - 390 3333 Ext. 4771 Fax: +962 - 5 - 382 6348 =====================================